The inaugural NextGen Networking Fair, a new event from PMMI, The Association for Packaging and Processing Technologies, offers a one-of-a-kind matchmaking opportunity for PACK EXPO International and Pharma EXPO 2016 exhibitors and attendees to connect with the emerging workforce.

Sponsored by B&R Industrial Automation, the event debuts on Sunday, Nov. 6, 2016 from 3–5 p.m. during PACK EXPO International and Pharma EXPO 2016 in the Education & Workforce Development Pavilion, in the North Mezzanine of McCormick Place. The event provides employers in the processing and packaging industry, the opportunity to meet and connect with a targeted audience of talented students from packaging, processing, materials, package design and mechatronics programs.

“With the Baby Boomer generation increasingly opting for retirement, employers are looking for fresh talent to design, build, operate and service their highly advanced and automated packaging and processing systems. Recruiting and retaining capable new employees results in an important competitive advantage,” says Patricia Andersen, PMMI Education & Workforce Development Committee Chair. “In November many talented and skilled young people will be attending PACK EXPO International and this event is a perfect opportunity for processing and packaging employers to connect with gifted students to help guide them into careers in the processing and packaging field.”

Light refreshments will be served.

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Report by Hugo Hernandez Gusther, Eco preneur and founder of Edanaro